产品简介 Produsts Introduction

本机型为我公司专门为切割半导体硅片设计的一款机型，应用金刚石线切割，大切割幅面为Φ300mm

（12 英寸）。该设备具有精密温度控制系统，切片精度高，翘曲度小，切片质量稳定，切割成本低。

This series is specially designed for cutting semiconductor silicon wafers. The maximum cutting width is Φ300 mm (12 inches) with diamond wire cutting. It has a precise temperature 

control system, high slice precision, small warpage, stable slice quality and low cutting cost.

切割样品 Cutting sample

机型特点Characteristics

技术参数 Parameter